|
|
|
|
Item |
Production |
Prototype |
| Max
Layer Count |
18 |
30 |
| Max
Board Thickness |
0.175” |
0.200” |
| Min
Board Thickness |
0.014” |
0.012” |
| Drill
to Metal |
0.008” |
0.007” |
| Innerlayer
Registration |
+/-
0.003” |
+/-
0.003” |
| Line
Width/Spacing, Outer/Inner (17 micron) |
0.003”
/ 0.003”
|
0.003”
/ 0.003” |
| Aspect
Ratio |
</=
8:1 |
</=
12:1 |
| Min
QFP Pitch (not HASL) |
0.016” |
0.010” |
Controlled
Impedance(Single ended)
(Differential) |
50
- 90 ohms +/- 8%*
100 - 155 ohms +/- 10%* |
50
- 90 ohms +/- 7%*
100 - 155 ohms +/- 8%* |
| Max
Internal Copper Wt. |
6
oz |
6
oz |
| HDI(1+N+1
Max Layer Count) -Min Via Size
- Min Capture Pad Size |
0.004”
0.012” |
0.004”
0.012” |
|
|
| * Less than 10% impedance tolerance capability is design dependent.
|
High
Performance materials |
Production |
Prototype |
Bismalemide
Triazine
(BT) or equivalent |
Yes |
Yes |
| Nelco
N - 4000 - 13 (SI) |
Yes |
Yes |
| Nelco
N - 4000 - 13 |
Yes |
Yes |
| Getek
/ Megtron |
Yes |
Yes |
| Rogers
4350 |
Yes |
Yes |
Rogers
3003/3006
|
Yes |
Yes |
| Taconic
RF35 |
Yes |
Yes |
Hitachi
MCL-BE-67G
|
Yes |
Yes |
Polyclad
PCL-FR370HR
|
Yes |
Yes |
|
|
|
