Liquid photo-imageable solder mask (LPI)

10-40um

  Peelable solder mask

0.2-0.5mm

 Conductive Carbon Ink

≤20Ω

 Hot Air Solder Leveled finish (HASL)

1-30um

 Organic Solderability Preservatives

Entek Cu 106A HT, Preflux F2 LX
Thickness 0.2-0.6um

 Electrolytic Flash Gold

Ni: 2.5-10um  Au: 0.020-0.075um

 Electroless Immersion Gold

Ni: 2.0-10um  Au: 0.025-0.10um

 Gold tab/finger plating

Ni: 2.5-10um  Au: 0.25-1.50um

 Electroless Immersion Tin

0.3-2.0um

 Electroless Immersion Silver

 0.10-0.5um

 Selective Surface Treatment

ENIG+OSP，ENIG+G/F，
Plating Gold+HASL，Plating gold+G/F，
Immersion Silver+G/F，
Immersion Tin+G/F