| Features |
 Suitable for BGA with lower I/O counts |
| Fine line, microvia and registration technologies capable of 0.4 mm ball |
| pitch |
| Qualified material and surface treatment for Lead-free process |
| Excellent mounting stability and reliability |
| Copper filled via |
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| Applications |
| Cellular phone, UMPC, MP3 Player, PMP, GPS, memory card |
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