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 Backpanel / High Layer Count PCB |
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| Features |
 Largest panel format ~ 24” x 36” |
| Board thickness up to 0.375” |
| High layer count up to 40 layers |
| Quick turn, prototype and production volume |
| Quick turn, prototype and production volume |
| HDI microvia |
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| Applications |
| Telecommunication, high-end computing, industrial equipment, consumer |
| electronics |
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