| Features |
 Better reliability,signal integrity,noise reduction, and impedance control |
| Reduces mechanical space and device weight |
| Improves design freedom |
| HDI microvia |
| Cost-saving alternative to multi-layer FPC |
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| Applications |
| Cellular phone, bluetooth headset, LCM, DSC, camera module, MP3 player, |
| game console, battery |
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Rigid-flex PCB
